- Model NO.: XPLF D-16121301
- Type: Trapezoid/Radi Lock/HTC Grinding Pad
- Hole Size: 9mm, M8, M6
- Application: Coarse and Fine Grinding Concrete Floor
- Machinery: Fix on Most Floor Grinding Machine
- Quality: Export Quality
- Specification: redi lock grinding pad
- Diamond Grinding Tools: Metal Grinding Pad
- Grinding Segment Size: 40*12*12/40*10*10mm
- Grit: 16# 30# 60# 90# 120# etc..
- Metal Bond Segment: Hard Bond, Middle Hard Bond, Soft Bond
- Grinding Ways: Wet Grinding/Dry Grinding
- Trademark: Pulifei Diamond Grinding Pad
- Origin: Fujian China
Can remove solid epoxy,acetylene and other attached objects on the floor surface.
Polishing Pad Characteristics:
1.Soft bond for hard concrete
2.Middle bond for middle concrete
3.Hard bond for soft concrete
1.High heat and pressure resistance.
2.Fix on most floor polishing machine to levelling concrete floor.
3.Make old floor in a high gloss again,remove floor surfrace paint,stains.
Grit:16# 30# 60# 80# 150# other grit could be order by client
Segment size: 40*12*12/40*10*10mm
Both wet / dry grinding is possible.