HTC Resin Grinding Segment Concrete Polishing Pad

FOB Price: US $5-30 / Piece
Min. Order: 27 Pieces
Min. Order FOB Price
27 Pieces US $5-30/ Piece
Port: Xiamen, China
Transport Package: Paper Carton
Payment Terms: T/T, Western Union
HTC Resin Grinding Segment Concrete Polishing Pad

Basic Info

Product Description

  • Model NO.: XPLF D-17011904
  • Polishing Tools: Resin Bond Grinding Pad
  • Grit: #50,#100,#200,#400,#800,#1500,#3000
  • Application Machinery: Floor Grinder
  • Business Type: Internation Diamond Tools Exporter
  • Shipping Ways: Internation Express, Such DHL
  • Specification: Resin bond grinding pad
  • Grinding Type: Abrasive Pad
  • Material: Resin
  • Application: Fine Polishing / Grinding Concrete Floor
  • Connection Slot: HTC Fast Change system
  • Main Market: Europe,USA,South America,Russian
  • Trademark: Pulifei Diamond Grinding Pad
  • Origin: Fujian China

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